Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu 2+ -alkanolamine metallacycle compounds for electrically conductive layer formation
A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 °C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal–organic-decomposition (MOD) ink gave a copper film with high packing density and...
Saved in:
Published in | RSC advances Vol. 6; no. 15; pp. 12048 - 12052 |
---|---|
Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
2016
|
Online Access | Get full text |
Cover
Loading…
Summary: | A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 °C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal–organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 × 10
−6
Ω m). This novel process may open a new strategy in the field of printed electronics. |
---|---|
ISSN: | 2046-2069 2046-2069 |
DOI: | 10.1039/C5RA25058G |