Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu 2+ -alkanolamine metallacycle compounds for electrically conductive layer formation

A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 °C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal–organic-decomposition (MOD) ink gave a copper film with high packing density and...

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Published inRSC advances Vol. 6; no. 15; pp. 12048 - 12052
Main Authors Yonezawa, Tetsu, Tsukamoto, Hiroki, Yong, Yingqiong, Nguyen, Mai Thanh, Matsubara, Masaki
Format Journal Article
LanguageEnglish
Published 2016
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Summary:A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 °C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal–organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 × 10 −6 Ω m). This novel process may open a new strategy in the field of printed electronics.
ISSN:2046-2069
2046-2069
DOI:10.1039/C5RA25058G