Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions

• Published in: Science and technology of advanced materials Vol. 16; no. 3; pp. 033505 - 33522
• Main Authors: Ting Tan, Ai, Wen Tan, Ai, Yusof, Farazila
• Format: Journal Article
• Language: English
• Published: United States Taylor & Francis 01.06.2015; IOP Publishing; Taylor & Francis Ltd; Taylor & Francis Group
• Subjects: composite solder; Copper; Electronic packaging; Electronics; Formations; Intermetallic compounds; intermetallics compound; Lead free; lead free solder joint; Nanocomposites; nanoparticle addition; Nanoparticles; Reviews; Silver; Soldered joints; Solders; Thermal cycling; Tin; Tin base alloys; composite solder; nanoparticle addition; lead free solder joint; intermetallics compound
• ISSN: 1468-6996; 1878-5514
• DOI: 10.1088/1468-6996/16/3/033505

Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn-Ag-Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided.