D-Band GCPW-to-Waveguide Transition Using Silicon Micromachined Technology for Planar Integrated MMIC and Aperture Antenna
This paper proposes a D-band transversal transition from a ground coplanar waveguide (GCPW) to an air waveguide. Such design is critical to the radio frequency (RF) front end between the monolithic microwave integration circuit (MMIC) and aperture antenna especially in sub-terahertz frequency due to...
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Published in | IEEE antennas and wireless propagation letters pp. 1 - 5 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
IEEE
07.10.2024
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Subjects | |
Online Access | Get full text |
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Summary: | This paper proposes a D-band transversal transition from a ground coplanar waveguide (GCPW) to an air waveguide. Such design is critical to the radio frequency (RF) front end between the monolithic microwave integration circuit (MMIC) and aperture antenna especially in sub-terahertz frequency due to the high loss in dielectric substrate. Silicon micromachined technology, as an advanced packaging technology, not only features a multi-layer arrangement similar to the PCB technology, but also supports the development of air cavity inside it, such as the rectangular waveguide. Adopting this technology, a WR-6 waveguide with a reduced height of 150 μm is developed within silicon substrates. Moreover, inspired by the classical aperture-coupled antenna, a magnetic coupling structure comprising a short-circuit end and a same-layer coupling aperture are proposed to facilitate the mode transformation from quasiTEM to TE10. Benefiting from this structure, the signal from GCPW is effectively transmitted to the waveguide. Measurements of two back-to-back prototypes indicate that the average insertion loss of one proposed transition is 0.355 dB within D-band, and the 1 mm-length waveguide induces loss of 0.075 dB, respectively. The transition is with low profile of 400 μm and wide bandwidth of 42.9%, which is promising for planar sub-terahertz system |
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ISSN: | 1536-1225 1548-5757 |
DOI: | 10.1109/LAWP.2024.3476270 |