Intermetallic compounds in 3D integrated circuits technology: a brief review

The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-f...

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Bibliographic Details
Published inScience and technology of advanced materials Vol. 18; no. 1; pp. 693 - 703
Main Authors Annuar, Syahira, Mahmoodian, Reza, Hamdi, Mohd, Tu, King-Ning
Format Journal Article
LanguageEnglish
Published United States Taylor & Francis 31.12.2017
Taylor & Francis Ltd
Taylor & Francis Group
Subjects
106 Metallic materials
201 Electronics / Semiconductor / TCOs
302 Crystallization / Heat treatment / Crystal growth
3D-ICs
40 Optical, magnetic and electronic device materials
501 Chemical analyses
Downsizing
IMCs
Integrated circuits
Intermetallic compounds
Lead free
low-volume solder microbumps
microbumps
Optical, Magnetic and Electronic Device Materials
Pb-free solder joint
Reliability
Review
106 Metallic materials
501 Chemical analyses
Pb-free solder joint
40 Optical, magnetic and electronic device materials
302 Crystallization / Heat treatment / Crystal growth
low-volume solder microbumps
IMCs
3D-ICs
201 Electronics / Semiconductor / TCOs
microbumps
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Summary:The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-3
content type line 23
ObjectType-Review-1
ISSN:1468-6996
1878-5514
DOI:10.1080/14686996.2017.1364975