Morphological, mechanical, tribological, and thermal expansion properties of organoclay reinforced polyethylene composites

The morphological, mechanical, thermal, and tribological properties of high‐density polyethylene (HDPE) composites reinforced with organo‐modified nanoclay (3 and 6 wt%) were studied. A commercial maleic anhydride‐based polymeric compatibilizer (PEgMA) was used to improve the adhesion between the po...

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Published inPolymer engineering and science Vol. 53; no. 6; pp. 1279 - 1286
Main Authors Pöllänen, Maija, Suihkonen, Reija, Nevalainen, Katja, Koistinen, Arto P., Suvanto, Mika, Vuorinen, Jyrki, Pakkanen, Tuula T.
Format Journal Article
LanguageEnglish
Published Hoboken Wiley Subscription Services, Inc., A Wiley Company 01.06.2013
Wiley
Society of Plastics Engineers, Inc
Blackwell Publishing Ltd
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Summary:The morphological, mechanical, thermal, and tribological properties of high‐density polyethylene (HDPE) composites reinforced with organo‐modified nanoclay (3 and 6 wt%) were studied. A commercial maleic anhydride‐based polymeric compatibilizer (PEgMA) was used to improve the adhesion between the polyethylene and clay. Transmission electron microscopy (TEM) characterization of composites revealed that nanoclay exists mainly in a multilayered structure in the HDPE matrix. Mechanical testing of composites showed that Young's modulus and tensile strength increased with nanoclay content. Coefficients of the linear thermal expansion (CLTE) of HDPE–PEgMA–clay composites were slightly lower in the flow direction than those of HDPE–PEgMA. The tribological properties were measured in dry conditions against a steel counterface. The friction coefficient of the matrix was decreased by the addition of clay. Electron microscopic results suggested that the wear mechanism for HDPE and HDPE composites was mainly adhesive. Clay agglomerates were observed on the worn surfaces of the composites, which may partly explain decreased friction. POLYM. ENG. SCI., 2013. © 2012 Society of Plastics Engineers
Bibliography:ArticleID:PEN23376
ark:/67375/WNG-2J1T1R7P-P
Finnish Funding Agency for Technology and Innovation (Tekes, project NaKiKu of FinNano program)
istex:31C960ECDB913A8755E5611969241C2A5D7FBB99
ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0032-3888
1548-2634
DOI:10.1002/pen.23376