宽带电力线通信芯片的低功耗设计

针对宽带电力线通信芯片因工作频段宽和通信速率高而导致功耗较大的问题,在介绍宽带电力线通信单元及芯片的基础上,围绕芯片功耗的影响因素,从工作频段、物理层、MAC层及芯片级多方面详细分析了芯片的低功耗设计技术。目前宽带电力线通信芯片及模块已研发成功,测试结果表明完全满足国家电网用电信息采集系统对宽带电力线通信单元的功耗要求。...

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Published in电子技术应用 Vol. 43; no. 10; pp. 16 - 19
Main Author 周春良 周芝梅 杨晓平 李璐 冯曦 唐晓柯
Format Journal Article
LanguageChinese
Published 北京智芯微电子科技有限公司,国家电网公司重点实验室电力芯片设计分析实验室,北京100192 2017
北京智芯微电子科技有限公司,北京市电力高可靠性集成电路设计工程技术研究中心,北京100192
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ISSN0258-7998
DOI10.16157/j.issn.0258-7998.179015

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Summary:针对宽带电力线通信芯片因工作频段宽和通信速率高而导致功耗较大的问题,在介绍宽带电力线通信单元及芯片的基础上,围绕芯片功耗的影响因素,从工作频段、物理层、MAC层及芯片级多方面详细分析了芯片的低功耗设计技术。目前宽带电力线通信芯片及模块已研发成功,测试结果表明完全满足国家电网用电信息采集系统对宽带电力线通信单元的功耗要求。
Bibliography:Zhou Chunliang1,2,Zhou Zhimei1,2,Yang Xiaoping1,2,Li Lu1,2,Feng Xi1,2,Tang Xiaoke1,2 (1 .State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology, Beijing Smart-Chip Microelectronics Technology Co., Ltd., Beijing 100192, China ; 2.Beijing Engineering Research Center of High-Reliability IC with Power Industrial Grade, Beijing Smart-Chip Microelectronics Technology Co. ,Ltd., Beijing 100192, China)
broadband PLC ; chip ; low power ; communication unit ; electric energy data acquisition
Aiming at the problem of high power consumption caused by broad operating frequency band and high date rate of broadband power line communication(PLC) chip and based on the introduction of broadband PLC communication unit and chip, low power design techniques are analyzed in detail from various aspects of operating frequency band, physical layer, MAC layer and chip level around the influencing factor of chip power dissipation. Currently the broadband PLC chip and module have been devel- oped successfully, a
ISSN:0258-7998
DOI:10.16157/j.issn.0258-7998.179015