Synthesis of epoxy–clay nanocomposites. Influence of the nature of the curing agent on structure

• Published in: Polymer (Guilford) Vol. 42; no. 10; pp. 4493 - 4499
• Main Authors: Kornmann, X., Lindberg, H., Berglund, L.A.
• Format: Journal Article
• Language: English
• Published: Oxford Elsevier Ltd 2001; Elsevier
• Subjects: Applied sciences; Composites; Cure kinetics; Epoxy-clay; Exact sciences and technology; Forms of application and semi-finished materials; Nanocomposites; Polymer industry, paints, wood; Technology of polymers; Epoxy–clay; Nanocomposites; Cure kinetics; Organic clay; Montmorillonite; Dispersion degree; Curing agent; Epoxy resin; Mechanical properties; Dispersion reinforced material; Experimental study; Composite material; Structure processing relationship; Diamine; Curing(plastics); Morphology; Concentration effect; Comparative study
• ISSN: 0032-3861; 1873-2291; 1873-2291
• DOI: 10.1016/S0032-3861(00)00801-6

Epoxy–clay nanocomposites were synthesised by swelling an organophilic montmorillonite in a diglycidyl ether of bisphenol A resin with subsequent polymerisation. Three different curing agents were used: an aliphatic diamine and two cycloaliphatic diamines. The cure kinetics of these systems was evaluated by differential scanning calorimetry and the structure of the nanocomposites was characterised by X-ray diffraction and transmission electron microscopy. Successful nanocomposite synthesis was dependent not only on the cure kinetics of the epoxy system but also on the rate of diffusion of the curing agent into the galleries because it affects the intragallery cure kinetics. The nature of the curing agent influences these two phenomena substantially and therefore the resulting structure of the nanocomposite. The curing temperature controls the balance between the extragallery reaction rate of the epoxy system and the diffusion rate of the curing agent into the galleries. Thus, the choice of curing agent and curing conditions controls the extent of exfoliation of the clay in the material.