Al-Si电子封装材料粉末冶金法致密性研究
采用粉末冶金方法研究Al-Si复合材料的烧结行为.结果表明：随着Si含量从40％分别增加至50％,60％时,Al-Si复合材料的烧结致密度从99.7％逐渐降低至99.0％;随着粉末的中位粒度增大,Al-Si复合材料的烧结密度略有降低,但差别不十分明显;随着烧结温度的提高,材料致密度明显增加,且最合适的烧结温度在550～600℃之间;随着烧结压力的提高,Al 50Si复合材料致密度明显增加,这是因为烧结压力增加时,球形粉末受挤压产生的塑性变形增加,有效地减小了粉末之间的间隙,从而增加了烧结材料的致密度,但最佳的烧结压力为60MPa,制得Al-50Si复合材料的致密度高达99.3％....
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| Published in | 材料工程 no. 2; pp. 45 - 50 |
|---|---|
| Main Author | |
| Format | Journal Article |
| Language | Chinese |
| Published |
南京信息工程大学,南京210044%南京航空航天大学材料科学与技术学院,南京,210016%中国原子能科学研究院,北京,102413%南京信息工程大学,南京,210044
2014
南京航空航天大学材料科学与技术学院,南京210016 |
| Subjects | |
| Online Access | Get full text |
| ISSN | 1001-4381 1001-4381 |
| DOI | 10.3969/j.issn.1001-4381.2014.02.009 |
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| Abstract | 采用粉末冶金方法研究Al-Si复合材料的烧结行为.结果表明：随着Si含量从40％分别增加至50％,60％时,Al-Si复合材料的烧结致密度从99.7％逐渐降低至99.0％;随着粉末的中位粒度增大,Al-Si复合材料的烧结密度略有降低,但差别不十分明显;随着烧结温度的提高,材料致密度明显增加,且最合适的烧结温度在550～600℃之间;随着烧结压力的提高,Al 50Si复合材料致密度明显增加,这是因为烧结压力增加时,球形粉末受挤压产生的塑性变形增加,有效地减小了粉末之间的间隙,从而增加了烧结材料的致密度,但最佳的烧结压力为60MPa,制得Al-50Si复合材料的致密度高达99.3％. |
|---|---|
| AbstractList | 采用粉末冶金方法研究Al-Si复合材料的烧结行为.结果表明：随着Si含量从40％分别增加至50％,60％时,Al-Si复合材料的烧结致密度从99.7％逐渐降低至99.0％;随着粉末的中位粒度增大,Al-Si复合材料的烧结密度略有降低,但差别不十分明显;随着烧结温度的提高,材料致密度明显增加,且最合适的烧结温度在550～600℃之间;随着烧结压力的提高,Al 50Si复合材料致密度明显增加,这是因为烧结压力增加时,球形粉末受挤压产生的塑性变形增加,有效地减小了粉末之间的间隙,从而增加了烧结材料的致密度,但最佳的烧结压力为60MPa,制得Al-50Si复合材料的致密度高达99.3％. TB333; 采用粉末冶金方法研究Al-Si复合材料的烧结行为.结果表明:随着Si含量从40％分别增加至50％,60％时,Al-Si复合材料的烧结致密度从99.7％逐渐降低至99.0％;随着粉末的中位粒度增大,Al-Si复合材料的烧结密度略有降低,但差别不十分明显;随着烧结温度的提高,材料致密度明显增加,且最合适的烧结温度在550～600℃之间;随着烧结压力的提高,Al 50Si复合材料致密度明显增加,这是因为烧结压力增加时,球形粉末受挤压产生的塑性变形增加,有效地减小了粉末之间的间隙,从而增加了烧结材料的致密度,但最佳的烧结压力为60MPa,制得Al-50Si复合材料的致密度高达99.3％. |
| Author | 禹胜林 薛松柏 尹邦跃 黄薇 |
| AuthorAffiliation | 南京航空航天大学材料科学与技术学院,南京210016 南京信息工程大学,南京210044 中国原子能科学研究院,北京102413 |
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| Author_FL | HUANG Wei YIN Bang-yue YU Sheng-lin XUE Song-bai |
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| Copyright | Copyright © Wanfang Data Co. Ltd. All Rights Reserved. |
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| DOI | 10.3969/j.issn.1001-4381.2014.02.009 |
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| DocumentTitleAlternate | Sintering Densification of Al-Si Composite by Powder Metallurgy Method for Electronic Packaging |
| DocumentTitle_FL | Sintering Densification of Al-Si Composite by Powder Metallurgy Method for Electronic Packaging |
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| Keywords | density 电子封装 粉末冶金 致密度 Al-Si复合材料 powder metallurgy Al-Si composite electronic packaging |
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| Notes | 11-1800/TB The sintering behaviour of A1-Si composite was studied by using powder metallurgy method. The results show that the relative sintering density decreases from 99.7% to 99.0% when the Si content in the A1-Si composite is from 40 % to 60 %. The particle size distribution of the powders used in the sintering of A1-Si composite has a slight effect on the sintering density. Furthermore, sintering density increases obviously with the increase of sintering temperature, indicating the optimum sinte- ring temperature is between 550~C and 600~C. With the increase of sintering pressure, the sintering density of A1-50Si composite increases remarkably. Because of the higher pressure, the plastic deformation amount of those spherical powders used in the sintering of A1-Si composite increases so that the gap between the two neighbored powders is shortened, which benefits to the improvement of the sintering density. However, the optimum sintering pressure is 60MPa, and the corresponding relative sintering density of |
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| PublicationTitle | 材料工程 |
| PublicationTitleAlternate | Journal of Materials Engineering |
| PublicationTitle_FL | Journal of Materials Engineering |
| PublicationYear | 2014 |
| Publisher | 南京信息工程大学,南京210044%南京航空航天大学材料科学与技术学院,南京,210016%中国原子能科学研究院,北京,102413%南京信息工程大学,南京,210044 南京航空航天大学材料科学与技术学院,南京210016 |
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| SubjectTerms | Al-Si复合材料 电子封装 粉末冶金 致密度 |
| Title | Al-Si电子封装材料粉末冶金法致密性研究 |
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