Al-Si电子封装材料粉末冶金法致密性研究

采用粉末冶金方法研究Al-Si复合材料的烧结行为.结果表明：随着Si含量从40％分别增加至50％,60％时,Al-Si复合材料的烧结致密度从99.7％逐渐降低至99.0％;随着粉末的中位粒度增大,Al-Si复合材料的烧结密度略有降低,但差别不十分明显;随着烧结温度的提高,材料致密度明显增加,且最合适的烧结温度在550～600℃之间;随着烧结压力的提高,Al 50Si复合材料致密度明显增加,这是因为烧结压力增加时,球形粉末受挤压产生的塑性变形增加,有效地减小了粉末之间的间隙,从而增加了烧结材料的致密度,但最佳的烧结压力为60MPa,制得Al-50Si复合材料的致密度高达99.3％....

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Bibliographic Details
Published in材料工程 no. 2; pp. 45 - 50
Main Author 禹胜林 薛松柏 尹邦跃 黄薇
Format Journal Article
LanguageChinese
Published 南京信息工程大学,南京210044%南京航空航天大学材料科学与技术学院,南京,210016%中国原子能科学研究院,北京,102413%南京信息工程大学,南京,210044 2014
南京航空航天大学材料科学与技术学院,南京210016
Subjects
Al-Si复合材料
电子封装
粉末冶金
致密度
density
电子封装
粉末冶金
致密度
Al-Si复合材料
powder metallurgy
Al-Si composite
electronic packaging
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Summary:采用粉末冶金方法研究Al-Si复合材料的烧结行为.结果表明：随着Si含量从40％分别增加至50％,60％时,Al-Si复合材料的烧结致密度从99.7％逐渐降低至99.0％;随着粉末的中位粒度增大,Al-Si复合材料的烧结密度略有降低,但差别不十分明显;随着烧结温度的提高,材料致密度明显增加,且最合适的烧结温度在550～600℃之间;随着烧结压力的提高,Al 50Si复合材料致密度明显增加,这是因为烧结压力增加时,球形粉末受挤压产生的塑性变形增加,有效地减小了粉末之间的间隙,从而增加了烧结材料的致密度,但最佳的烧结压力为60MPa,制得Al-50Si复合材料的致密度高达99.3％.
Bibliography:11-1800/TB
The sintering behaviour of A1-Si composite was studied by using powder metallurgy method. The results show that the relative sintering density decreases from 99.7% to 99.0% when the Si content in the A1-Si composite is from 40 % to 60 %. The particle size distribution of the powders used in the sintering of A1-Si composite has a slight effect on the sintering density. Furthermore, sintering density increases obviously with the increase of sintering temperature, indicating the optimum sinte- ring temperature is between 550~C and 600~C. With the increase of sintering pressure, the sintering density of A1-50Si composite increases remarkably. Because of the higher pressure, the plastic deformation amount of those spherical powders used in the sintering of A1-Si composite increases so that the gap between the two neighbored powders is shortened, which benefits to the improvement of the sintering density. However, the optimum sintering pressure is 60MPa, and the corresponding relative sintering density of
ISSN:1001-4381
1001-4381
DOI:10.3969/j.issn.1001-4381.2014.02.009