Uprooting defects to enable high-performance III–V optoelectronic devices on silicon

• Published in: Nature communications Vol. 10; no. 1; pp. 4322 - 12
• Main Authors: Bioud, Youcef A., Boucherif, Abderraouf, Myronov, Maksym, Soltani, Ali, Patriarche, Gilles, Braidy, Nadi, Jellite, Mourad, Drouin, Dominique, Arès, Richard
• Format: Journal Article
• Language: English
• Published: London Nature Publishing Group UK 20.09.2019; Nature Publishing Group; Nature Portfolio
• Subjects: 140/133; 147/137; 147/143; 147/3; 639/301/1019; 639/301/1019/1020; 639/301/119/544; 639/301/299/1013; 639/301/357; Annealing; Computational grids; Cost control; Cost reduction; Defects; Dislocation; Dislocation density; Electrochemistry; Engineering Sciences; Etching; Germanium; Group III-V semiconductors; Humanities and Social Sciences; Misfit dislocations; multidisciplinary; Optical properties; Optoelectronic devices; Photonics; Science; Science (multidisciplinary); Semiconductor devices; Silicon; Silicon compounds; Silicon substrates; Substrates; Technology transfer; Uprooting
• ISSN: 2041-1723; 2041-1723
• DOI: 10.1038/s41467-019-12353-9

The monolithic integration of III-V compound semiconductor devices with silicon presents physical and technological challenges, linked to the creation of defects during the deposition process. Herein, a new defect elimination strategy in highly mismatched heteroepitaxy is demonstrated to achieve a ultra-low dislocation density, epi-ready Ge/Si virtual substrate on a wafer scale, using a highly scalable process. Dislocations are eliminated from the epilayer through dislocation-selective electrochemical deep etching followed by thermal annealing, which creates nanovoids that attract dislocations, facilitating their subsequent annihilation. The averaged dislocation density is reduced by over three orders of magnitude, from ~10 8 cm −2 to a lower-limit of ~10 4 cm −2 for 1.5 µm thick Ge layer. The optical properties indicate a strong enhancement of luminescence efficiency in GaAs grown on this virtual substrate. Collectively, this work demonstrates the promise for transfer of this technology to industrial-scale production of integrated photonic and optoelectronic devices on Si platforms in a cost-effective way. The use of promising group III-V materials for optoelectronic applications is hindered by the high density of threading dislocations when integrated with silicon technology. Here, the authors present an electrochemical deep etching strategy to drastically reduce the the defect density.