添加Ni箔中间层的Mg-Al扩散焊接接头界面结构和力学性能

采用扩散焊接工艺,通过添加Ni箔中间层对镁铝异种金属进行焊接。利用无损检测、电子探针、扫描电镜、万能材料试验机研究了Mg/Ni/Al焊接接头界面的组织结构和力学性能。结果表明：Ni箔中间层可以有效阻止界面处Mg,Al元素的相互扩散,接头界面处没有生成Mg-Al金属间化合物。在焊接温度440℃,保温时间90min时,接头抗剪强度达到最大值20.5MPa。Mg/Ni/Al接头由Al,Ni和Mg,Ni的相互扩散形成,接头界面形成Al-Ni过渡区和Mg-Ni过渡区,界面主要物相分别为Al3Ni2,Al3Ni和Mg2Ni,过渡区厚度随焊接温度升高而增加。...

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Bibliographic Details
Published in材料工程 Vol. 43; no. 1; pp. 13 - 17
Main Author 张建 罗国强 沈强 黄治军
Format Journal Article
LanguageChinese
Published 华中科技大学材料科学与工程学院,武汉430074%武汉理工大学材料复合新技术国家重点实验室,武汉,430070%武汉钢铁(集团)公司研究院,武汉,430080 2015
武汉钢铁(集团)公司研究院,武汉430080
武汉理工大学材料复合新技术国家重点实验室,武汉430070
Subjects
Mg-Al
Ni箔
扩散焊
显微结构
显微结构
diffusion bonding
Mg-Al
microstructure
Ni foil
Ni箔
扩散焊
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ISSN1001-4381
1001-4381
DOI10.11868/j.issn.1001-4381.2015.01.003

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Summary:采用扩散焊接工艺,通过添加Ni箔中间层对镁铝异种金属进行焊接。利用无损检测、电子探针、扫描电镜、万能材料试验机研究了Mg/Ni/Al焊接接头界面的组织结构和力学性能。结果表明：Ni箔中间层可以有效阻止界面处Mg,Al元素的相互扩散,接头界面处没有生成Mg-Al金属间化合物。在焊接温度440℃,保温时间90min时,接头抗剪强度达到最大值20.5MPa。Mg/Ni/Al接头由Al,Ni和Mg,Ni的相互扩散形成,接头界面形成Al-Ni过渡区和Mg-Ni过渡区,界面主要物相分别为Al3Ni2,Al3Ni和Mg2Ni,过渡区厚度随焊接温度升高而增加。
Bibliography:11-1800/TB
Magnesium and aluminum alloys were welded by diffusion bonding using Ni foil as interlayer. Scanning acoustic microscopy （SAM）, electronic probe microanalysis （EPMA）, scanning electron microscopy （SEM） and universal testing machine were used to characterize the interracial structure and mechanical properties of the joints. The results show that Mg and Al are bonded successfully by diffusion bonding using Ni interlayer and the Mg-Al inter-diffusion is inhibited. There is no Mg-Al in- termetallic compound formed. The maximum shear strength of 20. 5MPa is obtained at 440℃ for 90min. Mg/Ni/Al joints are formed by the inter-diffusion of Al, Ni and Mg, Ni. Al-Ni and Mg-Ni diffusion zone formed at the joint interface. AlaNi2 and AlaNi are formed at the Al-Ni diffusion zone, and Mg2 Ni is formed at the Mg-Ni diffusion zone. The thickness of diffusion zone increases with the increase of welding temperature.
Mg-Al ; Ni foil; diffusion bonding; microstructure
ZHANG Jian , LUO Guo-qiang ,SHEN Qiang , HUANG Zhi-ju
ISSN:1001-4381
1001-4381
DOI:10.11868/j.issn.1001-4381.2015.01.003