Improvement in Chemical Resistance of Positive-tone Photodefinable Poly(benzoxazole) Materials

Polyimide (PI) and poly(benzoxazole) (PBO) materials are widely used as stress buffer and rewiring cover layers to improve the reliability of semiconductors. With recent advances in this area, the chemical resistance of PI and PBO to organic solvents, acids and, in particular, strong bases is critic...

Full description

Saved in:
Bibliographic Details
Published inJournal of Photopolymer Science and Technology Vol. 23; no. 4; pp. 477 - 482
Main Authors Kotani, Masashi, Ohe, Masayuki, Motobe, Takeharu, Nakamura, Yuki, Taku, Konno, Minegishi, Tomonori, Ono, Keishi
Format Journal Article
LanguageEnglish
Published Hiratsuka The Society of Photopolymer Science and Technology(SPST) 01.01.2010
Japan Science and Technology Agency
Subjects
adhesion promoter
Adhesion tests
aluminum substrate
chemical resistance
Corrosion resistance
cross-linkable compounds
cyclic ether
Marketing
Penetration
Photopolymers
poly(benzoxazole)
Polyimide resins
Residual stress
Semiconductors
Solvents
zincate
Online AccessGet full text

Cover

More Information
Summary:Polyimide (PI) and poly(benzoxazole) (PBO) materials are widely used as stress buffer and rewiring cover layers to improve the reliability of semiconductors. With recent advances in this area, the chemical resistance of PI and PBO to organic solvents, acids and, in particular, strong bases is critical in avoiding penetration issues during the plating process. To address this issue, development work was focused on residual stress and adhesion to the substrate where selected adhesion promoters and cross-linkable compounds were tested. In this paper, a novel positive-tone photo-definable material that has excellent chemical resistance properties has been developed to meet these demands.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0914-9244
1349-6336
1349-6336
DOI:10.2494/photopolymer.23.477