Study on Adhesion Improvement of Polyimide Film

Polyimide (PI) materials have been widely used as stress buffer and rewiring cover layers to improve semiconductor reliability. As these applications require compatibility with various organic and/or inorganic materials, the effect of plasma treatment on the adhesion of PI to an anisotropic conducti...

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Bibliographic Details
Published inJournal of Photopolymer Science and Technology Vol. 22; no. 3; pp. 393 - 396
Main Authors Katoh, Kohji, Motobe, Takeharu, Ohe, Masayuki, Soejima, Kazuya, Kaneya, Yuichi, Tanaka, Toshiaki, Itabashi, Toshiaki
Format Journal Article
LanguageEnglish
Published Hiratsuka The Society of Photopolymer Science and Technology(SPST) 01.01.2009
Japan Science and Technology Agency
Subjects
Adhesion
Adhesion tests
Adhesive bonding
Adhesive strength
anisotropic conductive film
Buffers
Photopolymers
plasma treatment
polyimide
Polyimide resins
Semiconductors
under-fill molding compound
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Summary:Polyimide (PI) materials have been widely used as stress buffer and rewiring cover layers to improve semiconductor reliability. As these applications require compatibility with various organic and/or inorganic materials, the effect of plasma treatment on the adhesion of PI to an anisotropic conductive film (ACF) and an under-fill molding compound (UF) was investigated. In this paper, several gases were tested and the results found that N2 plasma treatment of the PI film produced an improvement in the adhesion of the PI to both ACF and UF due to stronger bonding at the interface.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0914-9244
1349-6336
1349-6336
DOI:10.2494/photopolymer.22.393