Momentum-resolved visualization of electronic evolution in doping a Mott insulator

High temperature superconductivity in cuprates arises from doping a parent Mott insulator by electrons or holes. A central issue is how the Mott gap evolves and the low-energy states emerge with doping. Here we report angle-resolved photoemission spectroscopy measurements on a cuprate parent compoun...

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Published inNature communications Vol. 12; no. 1; p. 1356
Main Authors Hu, Cheng, Zhao, Jianfa, Gao, Qiang, Yan, Hongtao, Rong, Hongtao, Huang, Jianwei, Liu, Jing, Cai, Yongqing, Li, Cong, Chen, Hao, Zhao, Lin, Liu, Guodong, Jin, Changqing, Xu, Zuyan, Xiang, Tao, Zhou, X. J.
Format Journal Article
LanguageEnglish
Published London Nature Publishing Group UK 01.03.2021
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Summary:High temperature superconductivity in cuprates arises from doping a parent Mott insulator by electrons or holes. A central issue is how the Mott gap evolves and the low-energy states emerge with doping. Here we report angle-resolved photoemission spectroscopy measurements on a cuprate parent compound by sequential in situ electron doping. The chemical potential jumps to the bottom of the upper Hubbard band upon a slight electron doping, making it possible to directly visualize the charge transfer band and the full Mott gap region. With increasing doping, the Mott gap rapidly collapses due to the spectral weight transfer from the charge transfer band to the gapped region and the induced low-energy states emerge in a wide energy range inside the Mott gap. These results provide key information on the electronic evolution in doping a Mott insulator and establish a basis for developing microscopic theories for cuprate superconductivity. How a Mott insulating state evolves into a conducting or superconducting state is a central issue in doping a Mott insulator and important to understand the physics in high temperature cuprate superconductors. Here, the authors visualize the electronic structure evolution of a Mott insulator within the full Mott gap region and address the fundamental issues.
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ISSN:2041-1723
2041-1723
DOI:10.1038/s41467-021-21605-6