Analysis on optimal heat exchanger size of thermoelectric cooler for electronic cooling applications

• Published in: Energy conversion and management Vol. 76; pp. 685 - 690
• Main Authors: Zhu, Lin, Tan, Hongbo, Yu, Jianlin
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier Ltd 01.12.2013; Elsevier
• Subjects: Allocations; Applied sciences; Coolers; Cooling; Devices using thermal energy; Electronics; Energy; Energy. Thermal use of fuels; Exact sciences and technology; Heat exchangers; Heat exchangers (included heat transformers, condensers, cooling towers); Heat transfer; Modeling; Optimization; Thermal conductivity; Thermoelectricity; Cooling; Performance; Modeling; Thermoelectricity; Optimization; Cooler; Heat exchanger
• ISSN: 0196-8904; 1879-2227
• DOI: 10.1016/j.enconman.2013.08.014

•Optimization of a thermoelectric cooler system is presented.•The total heat transfer area of heat exchangers is considered as a constraint.•The best performances are characterized by different optimal area allocation ratios.•Optimal area allocation ratios are mainly affected by hot side thermal conductance. In this paper, the theoretical analyses are conducted to explore the optimization problems of thermoelectric cooler (TEC) systems applied in electronic cooling. The study mainly focuses on the optimal heat exchanger configuration of a TEC system. The effects of total heat transfer area allocation ratio, thermal conductance of the TEC hot and cold side and TEM element material properties on the cooling performance of the TEC are investigated in detailed based on the developed mathematical model. The analysis results indicate that the highest coefficient of performance (COP), highest heat flux pumping capability of the TEC and lowest cold side temperature can be achieved by selecting an optimal heat transfer area allocation ratio. The optimal heat transfer area allocation ratio mainly depends on the relevant objective functions, the hot and cold side thermal conductance, total heat exchanger size and the TEM element material properties. These results reveal that the heat transfer area allocation ratio is an applicable characteristic of optimum design for TEC systems. It is hoped that the considerations and analysis results may provide guides for the design and application of practical thermoelectric cooler system in electronic cooling.