Towards micro-assembly of hybrid MOEMS components on a reconfigurable silicon free-space micro-optical bench

The 3D integration of hybrid chips is a viable approach for the micro-optical technologies to reduce the costs of assembly and packaging. In this paper a technology platform for the hybrid integration of MOEMS components on a reconfigurable silicon free-space micro-optical bench (FS-MOB) is presente...

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Bibliographic Details
Published inJournal of micromechanics and microengineering Vol. 20; no. 4; p. 045012
Main Authors Bargiel, S, Rabenorosoa, K, Clévy, C, Gorecki, C, Lutz, P
Format Journal Article
LanguageEnglish
Published Bristol IOP Publishing 01.04.2010
Institute of Physics
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Summary:The 3D integration of hybrid chips is a viable approach for the micro-optical technologies to reduce the costs of assembly and packaging. In this paper a technology platform for the hybrid integration of MOEMS components on a reconfigurable silicon free-space micro-optical bench (FS-MOB) is presented. In this approach a desired optical component (e.g. micromirror, microlens) is integrated with a removable and adjustable silicon holder which can be manipulated, aligned and fixed in the precisely etched rail of the silicon baseplate by use of a robotic micro-assembly station. An active-based gripping system allows modification of the holder position on the baseplate with nanometre precision. The fabrication processes of the micromachined parts of the micro-optical bench, based on bulk micromachining of standard silicon wafer and SOI wafer, are described. The successful assembly of the holders, equipped with a micromirror and a refractive glass ball microlens, on the baseplate rail is demonstrated.
Bibliography:ObjectType-Article-2
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ISSN:0960-1317
1361-6439
DOI:10.1088/0960-1317/20/4/045012