Reliability issues of lead-free solder joints in electronic devices

• Published in: Science and technology of advanced materials Vol. 20; no. 1; pp. 876 - 901
• Main Authors: Jiang, Nan, Zhang, Liang, Liu, Zhi-Quan, Sun, Lei, Long, Wei-Min, He, Peng, Xiong, Ming-Yue, Zhao, Meng
• Format: Journal Article
• Language: English
• Published: Abingdon Taylor & Francis 31.12.2019; Taylor & Francis Ltd; Taylor & Francis Group
• Subjects: 103 Composites; 106 Metallic materials; 201 Electronics / Semiconductor / TCOs; 212 Surface and interfaces; 40 Optical, magnetic and electronic device materials; 503 TEM, STEM, SEM; Automobile industry; crack; Electromigration; Electronic devices; Electronic packaging; Environmental protection; failure; IMC; Lead free; Lead-free solder; Miniaturization; Optical, Magnetic and Electronic Device Materials; reliability; Reliability analysis; Soldered joints; Static electricity
• ISSN: 1468-6996; 1878-5514
• DOI: 10.1080/14686996.2019.1640072

Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electronic devices originates during the packaging process, mostly due to the failure of solder joints. With the improvement of environmental protection awareness, lead-free solder joints have become a hot issue in recent years. This paper reviews the research progress on the reliability of lead-free solder joints and discusses the influence of temperature, vibration, tin whisker and electromigration on the reliability of solder joints. In addition, the measures to improve the reliability of solder joints are analyzed according to the problems of solder joints themselves, which provides a further theoretical basis for the study of the reliability of solder joints of electronic products in service.