Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

• Published in: Sensors (Basel, Switzerland) Vol. 15; no. 10; pp. 25882 - 25897
• Main Authors: Zhou, Xiuyun, Zhou, Jinlong, Tian, Guiyun, Wang, Yizhe
• Format: Journal Article
• Language: English
• Published: Switzerland MDPI AG 13.10.2015; MDPI
• Subjects: Automation; Classification; Cracks; defect detection; Defects; eddy current pulsed; Eddy currents; Feasibility studies; flip-chip solder balls; High density; infrared thermography; Magnetic fields; Numerical analysis; Sensors; Simulation; Solders; Thermography; China; infrared thermography; eddy current pulsed; flip-chip solder balls; defect detection

In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat mo...