Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat mo...

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Published inSensors (Basel, Switzerland) Vol. 15; no. 10; pp. 25882 - 25897
Main Authors Zhou, Xiuyun, Zhou, Jinlong, Tian, Guiyun, Wang, Yizhe
Format Journal Article
LanguageEnglish
Published Switzerland MDPI AG 13.10.2015
MDPI
Subjects
Automation
Classification
Cracks
defect detection
Defects
eddy current pulsed
Eddy currents
Feasibility studies
flip-chip solder balls
High density
infrared thermography
Magnetic fields
Numerical analysis
Sensors
Simulation
Solders
Thermography
China
infrared thermography
eddy current pulsed
flip-chip solder balls
defect detection
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Summary:In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.
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ISSN:1424-8220
1424-8220
DOI:10.3390/s151025882