A Phase-Field Model for In-Space Manufacturing of Binary Alloys

The integrity of the final printed components is mostly dictated by the adhesion between the particles and phases that form upon solidification, which is a major problem in printing metallic parts using available In-Space Manufacturing (ISM) technologies based on the Fused Deposition Modeling (FDM)...

Full description

Saved in:
Bibliographic Details
Published inMaterials Vol. 16; no. 1; p. 383
Main Authors Ghosh, Manoj, Hendy, Muhannad, Raush, Jonathan, Momeni, Kasra
Format Journal Article
LanguageEnglish
Published Switzerland MDPI AG 31.12.2022
MDPI
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:The integrity of the final printed components is mostly dictated by the adhesion between the particles and phases that form upon solidification, which is a major problem in printing metallic parts using available In-Space Manufacturing (ISM) technologies based on the Fused Deposition Modeling (FDM) methodology. Understanding the melting/solidification process helps increase particle adherence and allows to produce components with greater mechanical integrity. We developed a phase-field model of solidification for binary alloys. The phase-field approach is unique in capturing the microstructure with computationally tractable costs. The developed phase-field model of solidification of binary alloys satisfies the stability conditions at all temperatures. The suggested model is tuned for Ni-Cu alloy feedstocks. We derived the Ginzburg-Landau equations governing the phase transformation kinetics and solved them analytically for the dilute solution. We calculated the concentration profile as a function of interface velocity for a one-dimensional steady-state diffuse interface neglecting elasticity and obtained the partition coefficient, k, as a function of interface velocity. Numerical simulations for the diluted solution are used to study the interface velocity as a function of undercooling for the classic sharp interface model, partitionless solidification, and thin interface.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
National Aeronautics and Space Administration (NASA)
National Science Foundation (NSF)
USDOE Advanced Research Projects Agency - Energy (ARPA-E)
AR0001066; 80NSSC19M014; CBET-2042683
ISSN:1996-1944
1996-1944
DOI:10.3390/ma16010383