Activation of Mg implanted in GaN by multicycle rapid thermal annealing
A long-standing goal of GaN device research has been the development of a reliable, well-controlled process for p-GaN formation by ion implantation. Results to date have indicated an activation of 1% or less using high-temperature rapid thermal annealing (RTA) techniques and coimplantation. Although...
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Published in | Electronics letters Vol. 50; no. 3; pp. 197 - 198 |
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Main Authors | , , , , , , , |
Format | Journal Article |
Language | English |
Published |
Stevenage
The Institution of Engineering and Technology
30.01.2014
Institution of Engineering and Technology John Wiley & Sons, Inc |
Subjects | |
Online Access | Get full text |
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Summary: | A long-standing goal of GaN device research has been the development of a reliable, well-controlled process for p-GaN formation by ion implantation. Results to date have indicated an activation of 1% or less using high-temperature rapid thermal annealing (RTA) techniques and coimplantation. Although Mg is a relatively deep acceptor, this is still much less than the theoretically achievable value (8.2% based on the 160 meV acceptor level). A multicycle RTA process is presented that is capable of achieving up to 8% activation of the Mg-implanted GaN. This approaches the theoretical value, and represents a significant step in GaN device research. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0013-5194 1350-911X 1350-911X |
DOI: | 10.1049/el.2013.3214 |