Activation of Mg implanted in GaN by multicycle rapid thermal annealing

A long-standing goal of GaN device research has been the development of a reliable, well-controlled process for p-GaN formation by ion implantation. Results to date have indicated an activation of 1% or less using high-temperature rapid thermal annealing (RTA) techniques and coimplantation. Although...

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Published inElectronics letters Vol. 50; no. 3; pp. 197 - 198
Main Authors Anderson, T.J, Feigelson, B.N, Kub, F.J, Tadjer, M.J, Hobart, K.D, Mastro, M.A, Hite, J.K, Eddy, C.R
Format Journal Article
LanguageEnglish
Published Stevenage The Institution of Engineering and Technology 30.01.2014
Institution of Engineering and Technology
John Wiley & Sons, Inc
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Summary:A long-standing goal of GaN device research has been the development of a reliable, well-controlled process for p-GaN formation by ion implantation. Results to date have indicated an activation of 1% or less using high-temperature rapid thermal annealing (RTA) techniques and coimplantation. Although Mg is a relatively deep acceptor, this is still much less than the theoretically achievable value (8.2% based on the 160 meV acceptor level). A multicycle RTA process is presented that is capable of achieving up to 8% activation of the Mg-implanted GaN. This approaches the theoretical value, and represents a significant step in GaN device research.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0013-5194
1350-911X
1350-911X
DOI:10.1049/el.2013.3214