Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface

Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational spee...

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Published inMaterials Vol. 7; no. 11; pp. 7366 - 7378
Main Authors Huang, Ching An, Yeh, Yu Hu, Lin, Che Kuan, Hsieh, Chen Yun
Format Journal Article
LanguageEnglish
Published Switzerland MDPI AG 14.11.2014
MDPI
Subjects
ANODES
Anodic
Copper
corrosion
CORROSION PROTECTION
Corrosion resistance
DEPOSITION
electrochemical reactions
Electrodeposition
Electrodes
ELECTROPLATING
Energy consumption
Etching
Magnesium alloys
Magnesium base alloys
metal and alloys
Plating
thin films
Wetting
corrosion
electrochemical reactions
metal and alloys
thin films
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Abstract Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational speeds of the AZ80 electrode resulted in an uneven Cu deposition at the inner upper site of the U-shaped surface during the Cu electroplating process. This wetting effect could be deduced from the variation in the anodic potential during the galvanostatic etching. The corrosion resistance of the Cu-deposited AZ80 electrode can be considerably improved after Ni electroplating.
AbstractList Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational speeds of the AZ80 electrode resulted in an uneven Cu deposition at the inner upper site of the U-shaped surface during the Cu electroplating process. This wetting effect could be deduced from the variation in the anodic potential during the galvanostatic etching. The corrosion resistance of the Cu-deposited AZ80 electrode can be considerably improved after Ni electroplating.
Author Yeh, Yu Hu
Hsieh, Chen Yun
Huang, Ching An
Lin, Che Kuan
AuthorAffiliation Department of Mechanical Engineering, Chang Gung University, Taoyuan 333, Taiwan; E-Mails: d9922005@stmail.cgu.edu.tw (Y.H.Y.); cklin918@gmail.com (C.K.L.); ff127511@gmail.com (C.Y.H.)
AuthorAffiliation_xml – name: Department of Mechanical Engineering, Chang Gung University, Taoyuan 333, Taiwan; E-Mails: d9922005@stmail.cgu.edu.tw (Y.H.Y.); cklin918@gmail.com (C.K.L.); ff127511@gmail.com (C.Y.H.)
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BackLink https://www.ncbi.nlm.nih.gov/pubmed/28788252$$D View this record in MEDLINE/PubMed
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CitedBy_id crossref_primary_10_1016_j_corsci_2018_03_006
crossref_primary_10_5695_JKISE_2016_49_3_238
crossref_primary_10_5695_JKISE_2016_49_5_401
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Issue 11
Keywords corrosion
electrochemical reactions
metal and alloys
thin films
Language English
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Snippet Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via...
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StartPage 7366
SubjectTerms ANODES
Anodic
Copper
corrosion
CORROSION PROTECTION
Corrosion resistance
DEPOSITION
electrochemical reactions
Electrodeposition
Electrodes
ELECTROPLATING
Energy consumption
Etching
Magnesium alloys
Magnesium base alloys
metal and alloys
Plating
thin films
Wetting
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Title Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface
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