Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface

Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational spee...

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Published inMaterials Vol. 7; no. 11; pp. 7366 - 7378
Main Authors Huang, Ching An, Yeh, Yu Hu, Lin, Che Kuan, Hsieh, Chen Yun
Format Journal Article
LanguageEnglish
Published Switzerland MDPI AG 14.11.2014
MDPI
Subjects
ANODES
Anodic
Copper
corrosion
CORROSION PROTECTION
Corrosion resistance
DEPOSITION
electrochemical reactions
Electrodeposition
Electrodes
ELECTROPLATING
Energy consumption
Etching
Magnesium alloys
Magnesium base alloys
metal and alloys
Plating
thin films
Wetting
corrosion
electrochemical reactions
metal and alloys
thin films
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Summary:Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational speeds of the AZ80 electrode resulted in an uneven Cu deposition at the inner upper site of the U-shaped surface during the Cu electroplating process. This wetting effect could be deduced from the variation in the anodic potential during the galvanostatic etching. The corrosion resistance of the Cu-deposited AZ80 electrode can be considerably improved after Ni electroplating.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:1996-1944
1996-1944
DOI:10.3390/ma7117366