Surface Characteristics and Catalytic Activity of Copper Deposited Porous Silicon Powder

Porous structured silicon or porous silicon (PS) powder was prepared by chemical etching of silicon powder in an etchant solution of HF: HNO₃: H₂O (1:3:5 v/v). An immersion time of 4 min was sufficient for depositing Cu metal from an aqueous solution of CuSO₄ in the presence of HF. Scanning electron...

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Published inMaterials Vol. 7; no. 12; pp. 7737 - 7751
Main Authors Halim, Muhammad Yusri Abdul, Tan, Wei Leng, Bakar, Noor Hana Hanif Abu, Bakar, Mohamad Abu
Format Journal Article
LanguageEnglish
Published Switzerland MDPI AG 04.12.2014
MDPI
Subjects
Aqueous solutions
Catalysis
CHEMICAL ETCHING
Communication
Copper
Cu particles
DEPOSITION
ETCHING
Morphology
Oxidation
p-nitrophenol
Porous silicon
porous silicon powder
PROPERTIES
Reduction
Scanning electron microscopy
Silicon
SOLUTIONS
Surface properties
SURFACES
porous silicon powder
p-nitrophenol
Cu particles
surface properties
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Summary:Porous structured silicon or porous silicon (PS) powder was prepared by chemical etching of silicon powder in an etchant solution of HF: HNO₃: H₂O (1:3:5 v/v). An immersion time of 4 min was sufficient for depositing Cu metal from an aqueous solution of CuSO₄ in the presence of HF. Scanning electron microscopy (SEM) analysis revealed that the Cu particles aggregated upon an increase in metal content from 3.3 wt% to 9.8 wt%. H₂-temperature programmed reduction (H₂-TPR) profiles reveal that re-oxidation of the Cu particles occurs after deposition. Furthermore, the profiles denote the existence of various sizes of Cu metal on the PS. The Cu-PS powders show excellent catalytic reduction on the p-nitrophenol regardless of the Cu loadings.
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These authors contributed equally to this work.
ISSN:1996-1944
1996-1944
DOI:10.3390/ma7127737