All-dry flip-over stacking of van der Waals junctions of 2D materials using polyvinyl chloride

We demonstrated an all-dry polymer-to-polymer transfer technique for two-dimensional (2D) crystal flakes using a polyvinyl chloride (PVC) layer deposited on a piece of polydimethylsiloxane (PDMS). Unexpectedly, the pickup/release temperatures were modified in wider temperature range simply by changi...

Full description

Saved in:
Bibliographic Details
Published inScientific reports Vol. 12; no. 1; p. 21963
Main Authors Onodera, Momoko, Wakafuji, Yusai, Hashimoto, Taketo, Masubuchi, Satoru, Moriya, Rai, Zhang, Yijin, Watanabe, Kenji, Taniguchi, Takashi, Machida, Tomoki
Format Journal Article
LanguageEnglish
Published England Nature Publishing Group UK 19.12.2022
Nature Portfolio
Online AccessGet full text

Cover

Loading…
More Information
Summary:We demonstrated an all-dry polymer-to-polymer transfer technique for two-dimensional (2D) crystal flakes using a polyvinyl chloride (PVC) layer deposited on a piece of polydimethylsiloxane (PDMS). Unexpectedly, the pickup/release temperatures were modified in wider temperature range simply by changing the thickness of the PVC layer than changing the plasticizer ratio. Utilizing the difference in the pickup/release temperatures depending on the PVC film thickness, 2D flakes were transferred from a thicker PVC film to a thinner one. This polymer-to-polymer transfer technique can be utilized to flip over van der Waals heterostructures. As a demonstration, we fabricated a mountain-like stacked structure of hexagonal boron nitride flakes using the flip-over stacking technique. Finally, we compared the results of thermomechanical analysis with the pickup/release temperatures of the PVC/PDMS stamp. The PVC was revealed to be at the glass transition and in the viscoelastic flow regimes when the 2D flakes were picked up and dry released, respectively. Our polymer-to-polymer transfer method facilitates flip-over van der Waals stacking in an all-dry manner, expanding the possibility of 2D materials device fabrications.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:2045-2322
2045-2322
DOI:10.1038/s41598-022-26193-z