Development of Positive Working Photosensitive Polyimide Coatings for Semiconductor Packages

This paper describes an approach to develop a positive working photosensitive polyimide coating (positive-PSPI) for semiconductor packages. We designed a new polyimide back-bone for positive-PSPI from a point of solubility, adhesion to molding compound and copper migration. In addition, we found eff...

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Bibliographic Details
Published inJournal of Photopolymer Science and Technology Vol. 16; no. 2; pp. 221 - 226
Main Authors Suwa, Mitsuhito, Fujita, Youji, Yuba, Tomoyuki, Yoshida, Satoshi, Tomikawa, Masato
Format Journal Article
LanguageEnglish
Published Hiratsuka The Society of Photopolymer Science and Technology(SPST) 01.01.2003
Japan Science and Technology Agency
Subjects
adhesion
chemical resistance
copper
migration
molding compound
photosensitive polyimide
silicon
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Summary:This paper describes an approach to develop a positive working photosensitive polyimide coating (positive-PSPI) for semiconductor packages. We designed a new polyimide back-bone for positive-PSPI from a point of solubility, adhesion to molding compound and copper migration. In addition, we found effective adhesion improvers for Cu. From these experimental results, we succeed to develop new positive-PSPI coatings which are suitable for wafer level chip size packaging, bumping protection, as well as buffer coating.
ISSN:0914-9244
1349-6336
DOI:10.2494/photopolymer.16.221