Cross comparison of thin-film tensile-testing methods examined using single-crystal silicon, polysilicon, nickel, and titanium films

This paper reports on the results of comparing different types of tensile testing methods that are used to evaluate thin-film properties. We tested the same material fabricated on a single wafer using different testing techniques at five different research institutions. The testing methods were diff...

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Bibliographic Details
Published inJournal of microelectromechanical systems Vol. 14; no. 5; pp. 1178 - 1186
Main Authors Tsuchiya, T., Hirata, M., Chiba, N., Udo, R., Yoshitomi, Y., Ando, T., Sato, K., Takashima, K., Higo, Y., Saotome, Y., Ogawa, H., Ozaki, K.
Format Journal Article
LanguageEnglish
Published New York, NY IEEE 01.10.2005
Institute of Electrical and Electronics Engineers
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Summary:This paper reports on the results of comparing different types of tensile testing methods that are used to evaluate thin-film properties. We tested the same material fabricated on a single wafer using different testing techniques at five different research institutions. The testing methods were different in the way the specimen was gripped. Materials tested were single-crystal silicon (SCS), polysilicon, nickel, and titanium films. Specimens with three different shapes were processed through the same fabrication steps. The tensile strength, fracture strain, and Young's modulus of the films were measured and compared. The measured values of the mechanical properties of all the testing methods were in good agreement with each other, thus demonstrating their accuracy.
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ISSN:1057-7157
1941-0158
DOI:10.1109/JMEMS.2005.851820