Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

• Published in: Journal of materials science Vol. 54; no. 2; pp. 1741 - 1768
• Main Authors: Xiong, Ming-yue, Zhang, Liang
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.01.2019; Springer; Springer Nature B.V
• Subjects: Automobile industry; Characterization and Evaluation of Materials; Chemistry and Materials Science; Classical Mechanics; Coarsening; Copper; Crystallography and Scattering Methods; Electronic packaging; Embrittlement; Fatigue strength; Interface reactions; Intermetallic compounds; Lead free; Materials Science; Metals; Packaging; Polymer Sciences; Reliability analysis; Silver; Soldered joints; Soldering; Solders; Solid Mechanics; Substrates; Tin base alloys; Tin compounds; Cu6Sn5 Grains; Cu3Sn Layer; SAC Solder; Solder Joints; SnAgCu Solder
• ISSN: 0022-2461; 1573-4803
• DOI: 10.1007/s10853-018-2907-y

During soldering and service, intermetallic compounds (IMCs) have an important impact on the performance and reliability of electronic products. A thin and continuous intermetallic layer facilitates the formation of reliable solder joints and improves the creep and fatigue resistance of solder joints. However, if the IMCs overgrow, the coarse IMC becomes brittle and tends to crack under stress, leading to a decrease in solder joint reliability. Based on the latest developments in the field of lead-free solders at home and abroad, this paper comprehensively reviews the interfacial reaction between SnAgCu Pb-free solders and different substrates and the growth behavior of IMCs and clarifies the growth mechanism of interfacial IMCs. The effects of the modification measures of lead-free solder on the IMCs and reliability of SnAgCu/substrate interface are analyzed, which provide a theoretical basis for the development and application of new lead-free solder.