Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

• Published in: IEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 7; no. 8; pp. 1191 - 1205
• Main Authors: Garimella, Suresh V., Persoons, Tim, Weibel, Justin A., Gektin, Vadim
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 01.08.2017; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Acoustic noise; Automobile industry; Automotive electronics; Automotive engineering; Computing time; Conferences; Consumer electronics; Cooling systems; Data centers; Drivers; Electric communication systems; Electronic devices; Electronic packaging thermal management; Enclosures; Energy management; information and communication networks; Information management; Liquid cooling; Noise control; Power efficiency; Product design; Redwood; Thermal management; thermal management of electronics; Vehicles; Wearable technology
• ISSN: 2156-3950; 2156-3985
• DOI: 10.1109/TCPMT.2016.2603600

This paper reviews thermal management challenges encountered in a wide range of electronics cooling applications from large-scale (data center and telecommunication) to small-scale systems (personal, portable/wearable, and automotive). This paper identifies drivers for progress and immediate and future challenges based on discussions at the 3rd Workshop on Thermal Management in Telecommunication Systems and Data Centers held in Redwood City, CA, USA, on November 4-5, 2015. Participants in this workshop represented industry and academia, with backgrounds ranging from data center thermal management and energy efficiency to high-performance computing and liquid cooling, thermal management in wearable and mobile devices, and acoustic noise management. By considering a wide range of electronics cooling applications with different lengths and time scales, this paper identifies both common themes and diverging views in the thermal management community.