The Dielectrophoretic Alignment of Biphasic Metal Fillers for Thermal Interface Materials

• Published in: Polymers Vol. 15; no. 24; p. 4653
• Main Authors: Lee, Yangwoo, Akyildiz, Kubra, Kang, Chanmi, So, Ju-Hee, Koo, Hyung-Jun
• Format: Journal Article
• Language: English
• Published: Switzerland MDPI AG 08.12.2023; MDPI
• Subjects: Aluminum; Composite structures; composites; Copper; Curing; Degassing of metals; Dielectrophoresis; dielectrophoretic chaining; Electric fields; Electrodes; Eutectic alloys; Fillers; Fillers (Materials); Fourier transforms; Gallium; Glass substrates; Heat conductivity; Heat sinks; Heat transfer; Interfaces; Light emitting diodes; liquid metal; Liquid metals; Metal particles; Metals; Polymers; Silicones; Structure; Thermal conductivity; thermal interface materials; Thermal properties; South Korea; United States > US; composites; dielectrophoretic chaining; thermal interface materials; liquid metal
• ISSN: 2073-4360; 2073-4360
• DOI: 10.3390/polym15244653

Pad-type thermal interface materials (TIMs) with composite structures are required to exhibit high thermal conductivity while maintaining conformal contact with the heat sink, which is strongly influenced by the type and content of the thermally conductive filler. This study presents that biphasic metal particles can be effectively aligned using the dielectrophoretic chaining (DEP-C) mechanism, thereby enhancing the thermal conductivity of a pad-type TIM. A eutectic gallium-indium (EGaIn) alloy liquid metal and solid copper were used as the filler materials with two different phases. The biphasic metal particle mixture of EGaIn and Cu (EGaIn-Cu) were better aligned by DEP-C than when they presented individually because fusion between the two particles increased the effective size. As expected, the thermal conductivity of the TIM composites increased when DEP-C aligned the filler. Notably, TIMs with both EGaIn-Cu fillers showed the largest increase in thermal conductivity, of up to 64.6%, and the highest thermal conductivity values after DEP-C application compared to TIMs with only the EGaIn or Cu filler. Finally, the heat dissipation performance of the TIM composite on a lit light-emitting diode is shown, where the TIM with DEP-C-aligned fillers exhibits improved performance.