Thermal and Electrical Properties of Additively Manufactured Polymer-Boron Nitride Composite

• Published in: Polymers Vol. 15; no. 5; p. 1214
• Main Authors: Bondareva, Julia V, Chernodoubov, Daniil A, Dubinin, Oleg N, Tikhonov, Andrey A, Simonov, Alexey P, Suetin, Nikolay V, Tarkhov, Mikhail A, Popov, Zakhar I, Kvashnin, Dmitry G, Evlashin, Stanislav A, Safonov, Alexander A
• Format: Journal Article
• Language: English
• Published: Switzerland MDPI AG 28.02.2023; MDPI
• Subjects: 3-D printers; 3D printing; 3D-printed microelectronics; Additive manufacturing; Boron; Boron nitride; Composite materials; Electric fields; Electric properties; Electrical properties; Electronic components; Electronic components industry; Electronic devices; Heat conductivity; Instrument industry; International economic relations; Methods; Morphology; Overheating; Percolation; photopolymer; Photopolymers; Polymerization; Polymers; Power semiconductor devices; Radiators; Scanning electron microscopy; Software; Temperature; thermal and electrical conductivity; Thermal conductivity; thermal management; Three dimensional printing; Transistors; Viscosity; United States; Russia; United States > US; photopolymer; thermal and electrical conductivity; additive manufacturing; boron nitride; 3D-printed microelectronics; thermal management
• ISSN: 2073-4360; 2073-4360
• DOI: 10.3390/polym15051214

The efficiency of electronic microchip-based devices increases with advancements in technology, while their size decreases. This miniaturization leads to significant overheating of various electronic components, such as power transistors, processors, and power diodes, leading to a reduction in their lifespan and reliability. To address this issue, researchers are exploring the use of materials that offer efficient heat dissipation. One promising material is a polymer-boron nitride composite. This paper focuses on 3D printing using digital light processing of a model of a composite radiator with different boron nitride fillings. The measured absolute values of the thermal conductivity of such a composite in the temperature range of 3-300 K strongly depend on the concentration of boron nitride. Filling the photopolymer with boron nitride leads to a change in the behavior of the volt-current curves, which may be associated with the occurrence of percolation currents during the deposition of boron nitride. The ab initio calculations show the behavior and spatial orientation of BN flakes under the influence of an external electric field at the atomic level. These results demonstrate the potential use of photopolymer-based composite materials filled with boron nitride, which are manufactured using additive techniques, in modern electronics.