Vacuum-Assisted Aerosol Deposition of a Low-Dielectric-Constant Periodic Mesoporous Organosilica Film

Low‐dielectric‐constant periodic mesoporous organosilica thin films are fabricated by vacuum‐assisted aerosol deposition, a vapor‐phase delivery technique favored by the semiconductor industry. The mesostructured films possess a combination of dielectric and mechanical properties that make them an i...

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Bibliographic Details
Published inAdvanced materials (Weinheim) Vol. 22; no. 1; pp. 99 - 102
Main Authors Wang, Wendong, Grozea, Daniel, Kim, Ara, Perovic, Douglas D., Ozin, Geoffrey A.
Format Journal Article
LanguageEnglish
Published Weinheim WILEY-VCH Verlag 05.01.2010
WILEY‐VCH Verlag
Subjects
Aerosols - chemistry
Electric Conductivity
mesoporous materials
organosilica
Porosity
self-assembly
Silicon Dioxide - chemistry
thin films
Vacuum
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Summary:Low‐dielectric‐constant periodic mesoporous organosilica thin films are fabricated by vacuum‐assisted aerosol deposition, a vapor‐phase delivery technique favored by the semiconductor industry. The mesostructured films possess a combination of dielectric and mechanical properties that make them an ideal candidate for insulating materials on semiconductor chips (see image).
Bibliography:istex:149D7CE97A710A6D9146BE098F1D3577B1BD12F4
ark:/67375/WNG-KQ7FT2FC-V
ArticleID:ADMA200901498
Natural Sciences and Engineering Research Council (NSERC) of Canada
ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ObjectType-Article-2
ObjectType-Feature-1
ISSN:0935-9648
1521-4095
DOI:10.1002/adma.200901498