HTS Pancake Coils Without Turn-to-Turn Insulation

• Published in: IEEE transactions on applied superconductivity Vol. 21; no. 3; pp. 1592 - 1595
• Main Authors: Seungyong Hahn, Dong Keun Park, Bascunan, J, Iwasa, Y
• Format: Journal Article Conference Proceeding
• Language: English
• Published: New York, NY IEEE 01.06.2011; Institute of Electrical and Electronics Engineers; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Applied sciences; Coils; Electrical engineering. Electrical power engineering; Electrical power engineering; Electromagnets; Exact sciences and technology; High temperature superconductors; HTS pancake coils; Insulation; mechanical integrity; Miscellaneous; Nickel; no-insulation winding; Power networks and lines; Power supplies; Superconducting magnets; Thermal stability; turn-to-turn-insulation; Various equipment and components; Performance evaluation; no-insulation winding; mechanical integrity; Electric circuit; Modeling; Superconducting coils; Thermal stability; HTS pancake coils; Critical current; Electrical network; Equivalent circuit; Overcurrent; turn-to-turn-insulation; Current density; High temperature superconductor; Machine windings
• ISSN: 1051-8223; 1558-2515
• DOI: 10.1109/TASC.2010.2093492

This paper reports a study of HTS pancake coils without turn-to-turn insulation. Three no-insulation (NI) pancake coils were wound: each single and double pancake coil of Bi2223 conductor and one single pancake of ReBCO conductor. An equivalent electrical circuit for modeling NI coils was verified by two sets of test: 1) charge-discharge; and 2) sudden discharge. Also, an overcurrent test in which a current exceeding a coil's critical current by 2.3 times was performed, and analysed, to demonstrate that in terms of stability NI HTS coils outperform their counterparts. The new NI winding offers HTS coils enhanced performance in three key parameters: overall current density; thermal stability; and mechanical integrity.