Thermal properties of diamond/Al composites by pressure infiltration：comparison between methods of coating Ti onto diamond surfaces and adding Si into Al matrix

This study was pertained to the effects of Ti coating on diamond surfaces and Si addition into Al matrix on the thermal conductivity（TC） and the coefficient of thermal expansion（CTE） of diamond/Al composites by pressure infiltration.The fracture surfaces,interface microstructures by metal electro-et...

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Bibliographic Details
Published inRare metals Vol. 35; no. 3; pp. 249 - 255
Main Authors Guo, Cai-Yu, He, Xin-Bo, Ren, Shu-Bin, Qu, Xuan-Hui
Format Journal Article
LanguageEnglish
Published Beijing Nonferrous Metals Society of China 01.03.2016
Springer Nature B.V
Subjects
Aluminum
Biomaterials
Chemistry and Materials Science
Coating
Coating effects
Composite materials
Diamonds
Energy
Fracture surfaces
Heat conductivity
Heat transfer
Infiltration
Interfacial bonding
Materials Engineering
Materials Science
Metallic Materials
Methods
Nanoscale Science and Technology
Physical Chemistry
Plasma sintering
Powder metallurgy
Pressure effects
Silicon
Thermal conductivity
Thermal expansion
Thermodynamic properties
Titanium
压力浸渗
复合材料
热性能
金刚石涂层
金刚石表面
钛涂层
铝基体
Metal matrix composites
Thermal conductivity
Coefficient of thermal expansion
Pressure infiltration
Coating
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Summary:This study was pertained to the effects of Ti coating on diamond surfaces and Si addition into Al matrix on the thermal conductivity（TC） and the coefficient of thermal expansion（CTE） of diamond/Al composites by pressure infiltration.The fracture surfaces,interface microstructures by metal electro-etching and interfacial thermal conductance of the composites prepared by two methods were compared.The results reveal that Ti coating on diamond surfaces and only12.2 wt% Si addition into Al matrix could both improve the interfacial bonding and increase the TCs of the composites.But the Ti coating layer introduces more interfacial thermal barrier at the diamond/Al interface compared to adding 12.2 wt% Si into Al matrix.The diamond/Al composite with 12.2 wt% Si addition exhibits maximum TC of 534 W·m^-1·K^-1and a very low CTE of 8.9×10^-6K^-1,while the coating Ti-diamond/Al composite has a TC of 514 W·m^-1·K^-1 and a CTE of 11.0×10^-6K^-1.
Bibliography:This study was pertained to the effects of Ti coating on diamond surfaces and Si addition into Al matrix on the thermal conductivity（TC） and the coefficient of thermal expansion（CTE） of diamond/Al composites by pressure infiltration.The fracture surfaces,interface microstructures by metal electro-etching and interfacial thermal conductance of the composites prepared by two methods were compared.The results reveal that Ti coating on diamond surfaces and only12.2 wt% Si addition into Al matrix could both improve the interfacial bonding and increase the TCs of the composites.But the Ti coating layer introduces more interfacial thermal barrier at the diamond/Al interface compared to adding 12.2 wt% Si into Al matrix.The diamond/Al composite with 12.2 wt% Si addition exhibits maximum TC of 534 W·m^-1·K^-1and a very low CTE of 8.9×10^-6K^-1,while the coating Ti-diamond/Al composite has a TC of 514 W·m^-1·K^-1 and a CTE of 11.0×10^-6K^-1.
Metal matrix composites Coating Thermal conductivity Coefficient of thermal expansion Pressure infiltration
11-2112/TF
ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:1001-0521
1867-7185
DOI:10.1007/s12598-015-0672-5