Thermal analysis of LED package

• Published in: Microelectronics international Vol. 23; no. 1; pp. 19 - 25
• Main Authors: Aizar Abdul Karim, N, Aswatha Narayana, P.A, Seetharamu, K.N
• Format: Journal Article
• Language: English
• Published: Bradford Emerald Group Publishing Limited 01.01.2006; MCB University Press
• Subjects: Applied sciences; Codes; Conductivity; Design; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Fluid dynamics; Heat conductivity; Heat resistance; Integrated circuits; Light emitting diodes; Lightemitting diodes; Optoelectronic devices; Package design; Printed circuit boards; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Semiconductors; Sensitivity analysis; Simulation; Studies; Thermal efficiency; Thermal energy; Simulation; Light-emitting diodes; Thermal efficiency; Performance evaluation; Mild steel; Sensitivity analysis; Prototype; Computational fluid dynamics; Thermal behavior; System design; Optimal design; Light emitting diode; Alloy steel; Thermal resistance; Coding; Electronic packaging; Optoelectronic device; Thermal analysis; Via hole
• ISSN: 1356-5362; 1758-812X
• DOI: 10.1108/13565360610642714

Purpose - To demonstrate thermal modeling technique for a through hole light emitting diode (LED) package using a commercial computational fluid dynamic (CFD) code and to improve its thermal performance through a series of sensitivity analyses.Design methodology approach - Thermal resistance of the standard through hole LED is calculated using the simulation result. The result is then compared with actual measurement to establish the correct model. Using the validated model, series of sensitivity analyses are carried out through simulation. Taking the most optimum design, a prototype of the improved LED is fabricated and the thermal resistance performance is compared with the simulation result.Findings - The simulation result of the standard LED is close to actual measurement with 5 percent difference. The thermal resistance of the through hole LED is reduced by changing the leadframe material from mild steel to copper alloy and increasing the leadframe width. Combination of both design changes resulted in thermal resistance reduction of 51 percent.Originality value - This paper identified the practicality of using CFD codes in achieving fast and accurate result in thermal modeling of LED package and also offers solutions on reducing the LED thermal resistance.