Electroless deposition and evaluation of Cu/multiwalled carbon nanotube composite films on acrylonitrile butadiene styrene resin

• Published in: Surface & coatings technology Vol. 254; pp. 224 - 229
• Main Authors: Arai, Susumu, Kanazawa, Taishi
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 15.09.2014; Elsevier
• Subjects: ABS resins; Acrylonitrile butadiene styrene (ABS) resin; ADHESION; Adhesion strength; CARBON BASE MATERIALS; Copper; Copper composite; Cross-disciplinary physics: materials science; rheology; DEPOSITION; Electroless copper plating; Electroless deposition; Exact sciences and technology; Frictional properties; Materials science; Methods of deposition of films and coatings; film growth and epitaxy; Multi wall carbon nanotubes; Multiwalled carbon nanotube; Physics; PLATING; POLYSTYRENE; RESINS; Sodium; Sulfates; Surface treatments; TUBE; Copper composite; Multiwalled carbon nanotube; Frictional properties; Acrylonitrile butadiene styrene (ABS) resin; Electroless deposition; Adhesion strength; Mechanical strength; Carbon nanotubes; Surface treatments; Adhesion; Carbon; Thin films; Adhesive strength; Composite materials; Chemical deposition
• ISSN: 0257-8972; 1879-3347
• DOI: 10.1016/j.surfcoat.2014.06.017

Cu/multiwalled carbon nanotube (MWCNT) composite films were fabricated by electroless deposition on acrylonitrile butadiene styrene (ABS) resin substrates. Four types of MWCNTs with different dimensions were added to the electroless copper plating baths together with the dispersants sodium lauryl sulfate and hydroxypropyl cellulose. The ABS resin substrates were first subjected to a roughening treatment to improve film adhesion. The microstructure of the composite films was characterized, and it was found that the MWCNTs were uniformly dispersed. The adhesion strength for the films was as high as that for electroless copper films. The composite films had an electrical resistivity in the range of 2.39–2.72μΩcm, and their coefficient of friction was considerably lower than that for electroless copper films. •Cu/MWCNT composite films were fabricated on an ABS resin using an electroless plating technique.•Adhesion strengths of the Cu/MWCNT composite films were as high as the Cu alloy films.•Coefficients of friction of the Cu/MWCNT composite films were lower than those of the copper films.