Effect of etching with low concentration hydrofluoric acid on the bond strength of CAD/CAM resin block

The effect of etching for 90 s with low concentrations (0.5, 1.0, 2.0, 3.0, 3.5, and 4.0%) of hydrofluoric acid (HF) on the adhesiveness of computer-aided design/computer-aided manufacturing (CAD/CAM) resin blocks [CERASMART (CS), SHOFU BLOCK HC (HC), KATANA AVENCIA Block(KA), and VITA ENAMIC (EN)]...

Full description

Saved in:
Bibliographic Details
Published inDental Materials Journal Vol. 39; no. 6; pp. 1000 - 1008
Main Authors NIIZUMA, Yuiko, KOBAYASHI, Mikihiro, TOYAMA, Toshinari, MANABE, Atsufumi
Format Journal Article
LanguageEnglish
Published Japan The Japanese Society for Dental Materials and Devices 27.11.2020
Japan Science and Technology Agency
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:The effect of etching for 90 s with low concentrations (0.5, 1.0, 2.0, 3.0, 3.5, and 4.0%) of hydrofluoric acid (HF) on the adhesiveness of computer-aided design/computer-aided manufacturing (CAD/CAM) resin blocks [CERASMART (CS), SHOFU BLOCK HC (HC), KATANA AVENCIA Block(KA), and VITA ENAMIC (EN)] was investigated. Energy dispersive spectroscopy revealed that the silicon content of HC, KA, and EN groups remained almost constant with HF etching of ≤4%. HF etching increased the surface roughness of all blocks. The HF concentration resulting in the highest shear bond strength in each group was as follows: CS (2.0%), HC (3.0%), KA (3.5%) and EN (0.5%). Scanning electron microscopy revealed that the bonding interface of etched surfaces differed significantly from that of airborne-particle abrasion surfaces. Thus, low concentration HF etching is effective for surface treatment of CAD/CAM resin blocks. The etching effect and optimum HF concentration differ with the block composition and structure.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:0287-4547
1881-1361
DOI:10.4012/dmj.2018-398