Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics
A new approach is presented to overcome the disadvantages of oxidation and harsh sintering conditions of Cu nanoparticle (Cu NP) conductive inks simultaneously. In this process, oleylamine (OAM) adsorbed on particles was effectively eliminated via the reactive desorption by formic acid in alcohols;...
Saved in:
Published in | ACS omega Vol. 5; no. 22; pp. 13416 - 13423 |
---|---|
Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
American Chemical Society
09.06.2020
|
Online Access | Get full text |
Cover
Loading…
Summary: | A new approach is presented to overcome
the disadvantages of oxidation
and harsh sintering conditions of Cu nanoparticle (Cu NP) conductive
inks simultaneously. In this process, oleylamine (OAM) adsorbed on
particles was effectively eliminated via the reactive desorption by
formic acid in alcohols; meanwhile, Cu ion was generated on the surface.
The desorption of OAM resulted in more severe surface oxidation of
Cu NPs. The oxide (Cu
2
O) and Cu
2+
distributed
on the Cu NP surface could be reduced to Cu(0) by NaBH
4
solution and take on the role of soldering flux to weld particles
into a blocky structure. With the compact coalescence of particles
without oxides, the resistivity of metal patterns could fall below
20 μΩ·cm and exhibit proper adhesion. Thanks to the
sintering of Cu NPs at ambient conditions, the conductive patterns
could be facilely formed on thermosensitive substrates. As the oxide
state of Cu would be reduced during sintering, the partially oxidized
Cu nanoparticles could be directly applied to conductive inks. |
---|---|
Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 2470-1343 2470-1343 |
DOI: | 10.1021/acsomega.0c01678 |