Molecular breeding of yeast with higher metal-adsorption capacity by expression of histidine-repeat insertion in the protein anchored to the cell wall

• Published in: Journal of general and applied microbiology Vol. 46; no. 3; pp. 113 - 117
• Main Authors: Kambe-Honjoh, Hideko, Ohsumi, Keisuke, Shimoi, Hitoshi, Nakajima, Harushi, Kitamoto, Katsuhiko
• Format: Journal Article
• Language: English
• Published: Tokyo Applied Microbiology, Molecular and Cellular Biosciences Research Foundation 2000; Microbiology Research Foundation; Japan Science and Technology Agency
• Subjects: Aspergillus oryzae; Biological and medical sciences; Biotechnology; cell surface engineering; CWP1; Cwp1 protein; Fundamental and applied biological sciences. Psychology; Genetic engineering; Genetic technics; histidine; histidine repeat; metal adsorption; Methods. Procedures. Technologies; Miscellaneous; Saccharomyces cerevisiae; Synthetic digonucleotides and genes. Sequencing; Taka-amylase A; Recombinant microorganism; Yeast; Gene expression; Cell wall; Heavy metal; Fungi; Pollutant; Adsorption; Ascomycetes; Bioremediation; Recombinant protein; Fusion protein; Saccharomyces cerevisiae; Hybrid gene; Thallophyta
• ISSN: 0022-1260; 1349-8037
• DOI: 10.2323/jgam.46.113

A fusion protein of hexa-histidine repeat (His) and glycosylphosphatidylinositol (GPI)-anchor region of Saccharomyces cerevisiae Cwp1 with Aspergillus oryzae Taka-amylase A (TAA) was expressed on the yeast cell surface. The expressed fusion protein (TAA-His-Cwp1) was localized on the cell wall and demonstrated amylolytic activity. In comparison with the TAA-Cwp1 expressing strain, these cells exhibited 1.6- to 2.8-fold higher adsorbing capacity for Cu2+, Ni2+, and Zn2+.