Microchannel cooling device with perforated side walls: Design and modeling

We propose and analyze a novel two-phase microchannel cooling device that incorporates perforated side walls for potential use as an embedded thermal management solution for high heat flux semiconductor devices. A dense array of perforated side walls separate alternating liquid and vapor microchanne...

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Bibliographic Details
Published inInternational journal of heat and mass transfer Vol. 68; pp. 174 - 183
Main Authors Warrier, Gopinath R., Kim, Chang-Jin, Sungtaek Ju, Y.
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.01.2014
Subjects
Cooling
Devices
Electronics cooling
Heat flux
High heat flux
Liquids
Mathematical models
Microchannel
Microchannels
Semiconductor devices
Walls
Microchannel
Electronics cooling
High heat flux
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Summary:We propose and analyze a novel two-phase microchannel cooling device that incorporates perforated side walls for potential use as an embedded thermal management solution for high heat flux semiconductor devices. A dense array of perforated side walls separate alternating liquid and vapor microchannels, allowing the vapor generated through evaporation of liquid supplied through micro-perforations to flow only in the dedicated vapor channels. By separating the liquid and vapor flows, these “perspiring” side walls enable us to circumvent flow instabilities and other challenges associated with conventional two-phase microchannel cooling while at the same time effectively take advantage of the large extended surface areas available in high-aspect-ratio microchannels. One implementation of our design is parametrically analyzed using finite element modeling, demonstrating the potential of our proposed device for handling high heat flux electronic and optoelectronic semiconductor devices.
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ISSN:0017-9310
1879-2189
DOI:10.1016/j.ijheatmasstransfer.2013.09.022