A robust co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS

• Published in: Journal of microelectromechanical systems Vol. 10; no. 1; pp. 69 - 79
• Main Authors: Shih, C.-L., Lai, B.-K., Kahn, H., Phillips, S.M., Heuer, A.H.
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01.03.2001; Institute of Electrical and Electronics Engineers; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Applied sciences; Binary alloys; Exact sciences and technology; Fabrication; Intermetallics; Mechanical engineering. Machine design; Microactuators; Microelectromechanical devices; Microelectromechanical systems; Micromechanical devices; Nickel base alloys; Nickel compounds; Nickel titanides; Precision engineering, watch making; Production; Robustness; Shape memory alloys; Sputter deposition; Sputtering; Substrates; Temperature distribution; Temperature sensors; Thin films; Titanium alloys; Titanium compounds; Transistors; Precision engineering; Microactuators; High temperature; Micromachine; Titanium base alloys; Sputtering; Sputter coating; Thin film; Transformation temperature; Micromechanical devices; Shape memory alloy; Miniaturization; Nickel alloy; Electromechanical system
• ISSN: 1057-7157; 1941-0158
• DOI: 10.1109/84.911094

Co-sputtering has been used to fabricate equiatomic thin films of TiNi, a shape memory alloy which form the basis of microactuators with many applications in MEMS. Methods for overcoming the difficulties involved in obtaining equiatomic TiNi thin films with high transformation temperatures, and a robust procedure suitable for batch fabrication in a production environment, are described.