Degradation of poly(ethylene glycol) by electrolysis during the Cu electroplating: A combined experimental and density functional theory study
The polymer additives are key factor materials in the Cu electroplating process, essential for controlled acceleration and inhibition of Cu deposition. In this study, the degradation behavior of a polymer additive--poly(ethylene glycol) (PEG)--during the Cu electroplating was investigated by MALDI-T...
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Published in | Journal of applied polymer science Vol. 117; no. 4; pp. 2083 - 2089 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
Hoboken
Wiley Subscription Services, Inc., A Wiley Company
15.08.2010
Wiley |
Subjects | |
Online Access | Get full text |
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Summary: | The polymer additives are key factor materials in the Cu electroplating process, essential for controlled acceleration and inhibition of Cu deposition. In this study, the degradation behavior of a polymer additive--poly(ethylene glycol) (PEG)--during the Cu electroplating was investigated by MALDI-TOF MS technique. The PEG was completely degraded after 4 h at a constant electric current density of 13 mA/cm², whereas it showed no degradation without an electric field even at a very low pH (pH < 1). The pathways and energetics of PEG degradation by electrolysis in aqueous chloride medium was investigated using density functional theory calculations at the same time. It demonstrated how facile the decomposition of PEG internal radical is, which is generated via the hydrogen abstraction from PEG by hydroxyl radical formed at the anode in aqueous chloride medium under an electric field. |
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Bibliography: | http://dx.doi.org/10.1002/app.31025 ark:/67375/WNG-H4801FRP-H istex:9FD75699F21FDFDB3EF15C15762A5E2C31811B57 ArticleID:APP31025 ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 ObjectType-Article-2 ObjectType-Feature-1 |
ISSN: | 0021-8995 1097-4628 1097-4628 |
DOI: | 10.1002/app.31025 |