The unique and interactive effects of parent and school bonds on adolescent delinquency
Parent and school bonds are protective against delinquency. This study used longitudinal data and multilevel Poisson regression models (MLM) to examine unique and interactive associations of parent and school bonds on youth delinquency in a sample of rural adolescents (n=945; 84% White). We investig...
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Published in | Journal of applied developmental psychology Vol. 53; pp. 54 - 63 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
United States
Elsevier Inc
01.11.2017
Elsevier Science Ltd |
Subjects | |
Online Access | Get full text |
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Summary: | Parent and school bonds are protective against delinquency. This study used longitudinal data and multilevel Poisson regression models (MLM) to examine unique and interactive associations of parent and school bonds on youth delinquency in a sample of rural adolescents (n=945; 84% White). We investigated whether youth sex or transitioning to a new middle school moderated the linkages between parent and school bonds and later delinquency. Results indicated reduced delinquency was associated with positive parent and school relationships. Parent and school bonds interacted such that linkages between parent bonding and youth delinquency were stronger when youth also had high school bonding – suggesting an additive effect. However, interactive effects were only found when youth remained in the same school and became nonsignificant if they transitioned to a new school. Findings support prior evidence that parent and school bonds – and their interaction – play a unique role in reducing delinquency.
•Youth with strong bonds to parents and school are less delinquency in middle school.•Bonding interactions occurred only when youth did not transition to a new school.•No differences were found between girls and boys.•Implications for interventions are discussed. |
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Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 0193-3973 1873-7900 |
DOI: | 10.1016/j.appdev.2017.09.005 |