Substrate-facilitated nanoparticle sintering and component interconnection procedure

Room temperature substrate-facilitated sintering of nanoparticles is demonstrated using commercially available silver nanoparticle ink and inkjet printing substrates. The sintering mechanism is based on the chemical removal of the nanoparticle stabilizing ligand and is shown to provide conductivity...

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Bibliographic Details
Published inNanotechnology Vol. 21; no. 47; p. 475204
Main Authors Allen, Mark, Leppäniemi, Jaakko, Vilkman, Marja, Alastalo, Ari, Mattila, Tomi
Format Journal Article
LanguageEnglish
Published England IOP Publishing 26.11.2010
Subjects
Assembly
Inkjet printing
Nanocomposites
Nanomaterials
Nanostructure
Resistivity
Silver
Sintering
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Summary:Room temperature substrate-facilitated sintering of nanoparticles is demonstrated using commercially available silver nanoparticle ink and inkjet printing substrates. The sintering mechanism is based on the chemical removal of the nanoparticle stabilizing ligand and is shown to provide conductivity above one-fourth that of bulk silver. A novel approach to attach discrete components to printed conductors is presented, where the sintered silver provides the metallic interconnects with good electrical and mechanical properties. A process for printing and chip-on-demand assembly is suggested.
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ISSN:0957-4484
1361-6528
DOI:10.1088/0957-4484/21/47/475204