Interfacial Reaction and Wettability of 72Ag-28Cu Braze on CP-Ti Substrate Using Infrared Heating

Reactive wetting by infrared heating of a BAg-8 braze on a CP-Ti substrate is achieved at 1073 K (800 °C) for 300 seconds. Increasing the test temperature from 1073 K to 1123 K (800 °C to 850 °C) results in great improvement of the wettability on the CP-Ti substrate due to the lower melt viscosity a...

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Published inMetallurgical and materials transactions. A, Physical metallurgy and materials science Vol. 43; no. 6; pp. 1742 - 1746
Main Authors Shiue, R. K., Wu, S. K., Chen, F. Y., Yang, T. E.
Format Journal Article
LanguageEnglish
Published Boston Springer US 01.06.2012
Springer
Springer Nature B.V
Subjects
Alloying effects
Applied sciences
Brazing
Characterization and Evaluation of Materials
Chemistry and Materials Science
Communication
Copper
Eutectoid temperature
Exact sciences and technology
Heating
Infrared heating
Infrared radiation
Interface reactions
Materials Science
Melts
Metallic Materials
Metals. Metallurgy
Nanotechnology
Silver base alloys
Structural Materials
Substrates
Surfaces and Interfaces
Thin Films
Wettability
Braze Alloy
Wettability
Transmission Electron Microscope Specimen
Interfacial Reaction
Reactive Wetting
Interface
Interface reaction
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Summary:Reactive wetting by infrared heating of a BAg-8 braze on a CP-Ti substrate is achieved at 1073 K (800 °C) for 300 seconds. Increasing the test temperature from 1073 K to 1123 K (800 °C to 850 °C) results in great improvement of the wettability on the CP-Ti substrate due to the lower melt viscosity at higher test temperature and the alloying effect of Cu into the CP-Ti substrate to form the interfacial eutectoid layer.
Bibliography:ObjectType-Article-1
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ISSN:1073-5623
1543-1940
DOI:10.1007/s11661-012-1143-3