Dynamic Compensation Method for Humidity Sensors Based on Temperature and Humidity Decoupling

• Published in: Sensors (Basel, Switzerland) Vol. 22; no. 19; p. 7229
• Main Authors: Yang, Wenxuan, Li, Wenchang, Lu, Huaxiang, Liu, Jian, Zhang, Tianyi
• Format: Journal Article
• Language: English
• Published: Basel MDPI AG 23.09.2022; MDPI
• Subjects: Analysis; Boundary conditions; Complementary metal oxide semiconductors; Decoupling; Digital electronics; Dynamic characteristics; dynamic compensation; fast response; Humidity; humidity sensor; Methods; Nanowires; Process controls; Response time; Sensors; Signal processing; Silicon wafers; temperature and humidity decoupling; China
• ISSN: 1424-8220; 1424-8220
• DOI: 10.3390/s22197229

Currently, integrated humidity sensors with fast-response time are widely needed. The most commonly used polyimide capacitive humidity sensor has a long response time, which is difficult to meet the need for a fast response. Most studies focusing on technology and materials have a high cost and are difficult to ensure compatability with the CMOS process. The dynamic compensation method can shorten the response time by only adding digital circuits or software processing. However, conventional compensation technology is not suitable for humidity sensors due to temperature coupling. This paper proposes a new dynamic compensation method for humidity sensors based on the decoupling of temperature factors by analyzing the coupling relationship between sensor dynamic characteristics and temperature. Simulations and experiments were used to verify the proposed method. The experimental results show that the proposed method reduces the humidity response time of the sensor by 85.6%. The proposed method can effectively shorten the response time of humidity sensors.