Tunable architecture for flexible and highly conductive graphene–polymer composites

Printed electronics, particularly on flexible and textile substrates, raised a strong interest during the past decades. This work presents a good candidate for conductive inks based on a graphene/polymer nanocomposite material that gathers three main benefits that are 1 – neither clogging nor floccu...

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Bibliographic Details
Published inComposites science and technology Vol. 95; pp. 82 - 88
Main Authors Noël, Amélie, Faucheu, Jenny, Rieu, Mathilde, Viricelle, Jean-Paul, Bourgeat-Lami, Elodie
Format Journal Article
LanguageEnglish
Published Kidlington Elsevier Ltd 01.05.2014
Elsevier
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Summary:Printed electronics, particularly on flexible and textile substrates, raised a strong interest during the past decades. This work presents a good candidate for conductive inks based on a graphene/polymer nanocomposite material that gathers three main benefits that are 1 – neither clogging nor flocculation, 2 – spontaneous film formation around room temperature, 3 – high conductivity. Nanosized Multilayered Graphene (NMG) is produced through a solvent-free procedure, using a grinding process in water. These NMG suspensions are used to elaborate conductive composite materials through physical blending with emulsifier-free latex. The nanocomposite microstructure exhibits a well-defined cellular architecture that highlights the formation of continuous paths of fillers throughout the material. The conductivity behavior of the nanocomposite material was efficiently described using a percolation model: the conductivity can be tuned by changing the NMG content and the latex size. A low percolation threshold (0.1vol%) was obtained and the electrical conductivity reached 217Sm−1 for 6 vol% NMG. Efficient film forming occurs at room temperature leading to continuous and deformable materials, which is adequate for printing on flexible and textile substrates. The applicability in electronics is demonstrated by the use of the nanocomposite material in replacement of copper wires in a LED setup.
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ISSN:0266-3538
1879-1050
DOI:10.1016/j.compscitech.2014.02.013