Optimization of stepwise varying width microchannel heat sink for high heat flux applications

• Published in: Case studies in thermal engineering Vol. 18; p. 100587
• Main Authors: Abo-Zahhad, Essam M., Ookawara, Shinichi, Radwan, Ali, Elkady, M.F., El-Shazly, A.H.
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.04.2020; Elsevier
• Subjects: CPU; Fin; Heat sink; MultiObjective genetic algorithm; Stepwise varying width microchannel; CPU; Fin; MultiObjective genetic algorithm; Heat sink; Stepwise varying width microchannel
• ISSN: 2214-157X; 2214-157X
• DOI: 10.1016/j.csite.2020.100587

The semiconductor devices are widely employed for many applications. A significant amount of the heat must be dissipated properly to keep the devices' performance stable. Additionally, under high operation temperatures, a physical damage is possible due to thermal stresses that threaten the safety components and increase the failure rate. The development in the direction of more tightly packed electronic devices increases the challenges of offering an efficient cooling for these devices under high heat fluxes in a very restricted space. Hence, an advanced cooling technique is compulsory to attain the appropriate performance along with extending the lifespan of microelectronic devices. Stepwise varying width microchannel heat sink is considered one of the innovative cooling system from these microelectronic devices. In the current study, different designs of stepwise varying width microchannel heat sink were optimized, and their thermal performance was studied for more uniform cooling of microelectronics devices.