Electroceramic Thick Film Fabrication for MEMS

The production of thick film electroceramic films (10-100 micron thick) for micro-electromechanical system (MEMS) applications is of great interest due to the drive for miniaturisation, high power /sensitivity and system integration. A range of techniques are reviewed for the deposition and patterni...

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Bibliographic Details
Published inJournal of electroceramics Vol. 12; no. 1-2; pp. 19 - 32
Main Authors Dorey, R A, Whatmore, R W
Format Journal Article
LanguageEnglish
Published Dordrecht Springer Nature B.V 01.01.2004
Subjects
Ceramics
Completeness
Lead (metal)
Microelectronics
Patterning
Piezoelectricity
Silicon substrates
Studies
Systems integration
Thick films
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Summary:The production of thick film electroceramic films (10-100 micron thick) for micro-electromechanical system (MEMS) applications is of great interest due to the drive for miniaturisation, high power /sensitivity and system integration. A range of techniques are reviewed for the deposition and patterning of oxide ceramic thick films for use in MEMS and microsystems. Issues associated with sintering of films on a constraining substrate (including the use of sintering aids) are examined with a view to maximising the densification of the films. Brief descriptions of thick film patterning techniques and typical dielectric and piezoelectric properties are given. Due to the high piezoelectric properties of Pb-containing electroceramics, and the drive for the use of silicon substrates, special attention has been given to interactions that can occur between Si and Pb during processing of the electroceramic thick films. Examples of Si/Pb system compatible electrode structures and diffusion barriers are given. 89 refs.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
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ISSN:1385-3449
1573-8663
DOI:10.1023/B:JECR.0000033999.74149.a3