Erbium emission in MOS light emitting devices: from energy transfer to direct impact excitation

The electroluminescence (EL) at 1.54 µm of metal-oxide-semiconductor (MOS) devices with Er3+ ions embedded in the silicon-rich silicon oxide (SRSO) layer has been investigated under different polarization conditions and compared with that of erbium doped SiO2 layers. EL time-resolved measurements al...

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Published inNanotechnology Vol. 23; no. 12; p. 125203
Main Authors Ramírez, J M, Ferrarese Lupi, F, Jambois, O, Berencén, Y, Navarro-Urrios, D, Anopchenko, A, Marconi, A, Prtljaga, N, Tengattini, A, Pavesi, L, Colonna, J P, Fedeli, J M, Garrido, B
Format Journal Article
LanguageEnglish
Published England IOP Publishing 30.03.2012
Institute of Physics (IOP)
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Summary:The electroluminescence (EL) at 1.54 µm of metal-oxide-semiconductor (MOS) devices with Er3+ ions embedded in the silicon-rich silicon oxide (SRSO) layer has been investigated under different polarization conditions and compared with that of erbium doped SiO2 layers. EL time-resolved measurements allowed us to distinguish between two different excitation mechanisms responsible for the Er3+ emission under an alternate pulsed voltage signal (APV). Energy transfer from silicon nanoclusters (Si-ncs) to Er3+ is clearly observed at low-field APV excitation. We demonstrate that sequential electron and hole injection at the edges of the pulses creates excited states in Si-ncs which upon recombination transfer their energy to Er3+ ions. On the contrary, direct impact excitation of Er3+ by hot injected carriers starts at the Fowler-Nordheim injection threshold (above 5 MV cm−1) and dominates for high-field APV excitation.
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ISSN:0957-4484
1361-6528
DOI:10.1088/0957-4484/23/12/125203